- sputter processing
- обработка (напр. поверхности) методом распыления
English-Russian electronics dictionary .
sputter processing
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Sputter deposition — is a physical vapor deposition (PVD) method of depositing thin films by sputtering, that is ejecting, material from a target, that is source, which then deposits onto a substrate, such as a silicon wafer. Resputtering is re emission of the… … Wikipedia
Plasma processing — is a plasma based material processing technology that aims at modifying the chemical and physical properties of a surface.Plasma processing techniques include: *Plasma activation *Plasma modification *Plasma functionalization *Plasma… … Wikipedia
Vacuum deposition — Not to be confused with Vacuum coating. Vacuum deposition is a family of processes used to deposit layers atom by atom or molecule by molecule at sub atmospheric pressure (vacuum) on a solid surface. The layers may be as thin as one atom to… … Wikipedia
vacuum technology — Introduction all processes and physical measurements carried out under conditions of below normal atmospheric pressure. A process or physical measurement is generally performed in a vacuum for one of the following reasons: (1) to remove the … Universalium
Etching (microfabrication) — Etching tanks used to perform Piranha, Hydrofluoric acid or RCA clean on 4 inch wafer batches at LAAS technological facility in Toulouse, France Etching is used in microfabrication to chemically remove layers from the surface of a wafer during… … Wikipedia
mass spectrometry — or mass spectroscopy Analytic technique by which chemical substances are identified by sorting gaseous ions by mass using electric and magnetic fields. A mass spectrometer uses electrical means to detect the sorted ions, while a mass spectrograph … Universalium
Nantenna — Figure 1. Spectral irradiance of wavelengths in the solar spectrum. The red shaded area shows the irradiance at sea level. There is less irradiance at sea level due to absorption of light by the atmosphere. A nantenna (nanoantenna) is a… … Wikipedia
Plasma-enhanced chemical vapor deposition — PECVD machine at LAAS technological facility in Toulouse, France. Plasma enhanced chemical vapor deposition (PECVD) is a process used to deposit thin films from a gas state (vapor) to a solid state on a substrate. Chemical reactions are involved… … Wikipedia
Auger electron spectroscopy — (AES; Auger pronounced|oːʒeː in French) is a common analytical technique used specifically in the study of surfaces and, more generally, in the area of materials science. Underlying the spectroscopic technique is the Auger effect, as it has come… … Wikipedia
Ohmic contact — An ohmic contact is a region on a semiconductor device that has been prepared so that the current voltage (I V) curve of the device is linear and symmetric. If the I V characteristic is non linear and asymmetric, the contact is not ohmic, but is… … Wikipedia
Thin film — A thin film is a layer of material ranging from fractions of a nanometer (monolayer) to several micrometers in thickness. Electronic semiconductor devices and optical coatings are the main applications benefiting from thin film construction. A… … Wikipedia
